Low-cost TSH (through-silicon hole) interposers for 3D IC integration

In this investigation, a SiP (system-in-package) which consists of a very low-cost interposer with through-silicon holes (TSHs) and with chips on its top- and bottom-side (a real 3D IC integration) is studied. Emphasis is placed on the fabrication of a test vehicle to demonstrate the feasibility of...

Full description

Saved in:
Bibliographic Details
Published in2014 IEEE 64th Electronic Components and Technology Conference (ECTC) pp. 290 - 296
Main Authors Lau, John H., Ching-Kuan Lee, Chau-Jie Zhan, Sheng-Tsai Wu, Yu-Lin Chao, Ming-Ji Dai, Ra-Min Tain, Heng-Chieh Chien, Chun-Hsien Chien, Ren-Shin Cheng, Yu-Wei Huang, Yuan-Chang Lee, Zhi-Cheng Hsiao, Wen-Li Tsai, Pai-Cheng Chang, Huan-Chun Fu, Yu-Mei Cheng, Li-Ling Liao, Wei-Chung Lo, Ming-Jer Kao
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2014
Subjects
Resists
Silicon
Strips
Substrates
Through-silicon vias
Tin
Online AccessGet full text

Cover

More Information
Summary:In this investigation, a SiP (system-in-package) which consists of a very low-cost interposer with through-silicon holes (TSHs) and with chips on its top- and bottom-side (a real 3D IC integration) is studied. Emphasis is placed on the fabrication of a test vehicle to demonstrate the feasibility of this SiP technology. The design, materials, and process of the top-chip, bottom-chip, TSH interposer, and final assembly will be presented. Shock and thermal cycling tests will be preformed to demonstrate the integrity of the SiP structure.
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2014.6897301