Inkjet printed electrically conductive structures for microelectronics

• Published in: Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) pp. 6 - 11
• Main Author: Felba, J.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.05.2011
• Subjects: Heating; Ink; Microelectronics; Printing; Resistance; Silver; Temperature measurement

Production of modern microelectronic devices and circuits needs technologies with the highest level of packaging process, resolution and repeatability. Ink jet technology with micro-dimensions nozzle is year by year wider used for this purpose. It makes possible to dispense small volumes of a materi...