Inkjet printed electrically conductive structures for microelectronics

Production of modern microelectronic devices and circuits needs technologies with the highest level of packaging process, resolution and repeatability. Ink jet technology with micro-dimensions nozzle is year by year wider used for this purpose. It makes possible to dispense small volumes of a materi...

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Bibliographic Details
Published inProceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) pp. 6 - 11
Main Author Felba, J.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2011
Subjects
Heating
Ink
Microelectronics
Printing
Resistance
Silver
Temperature measurement
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Summary:Production of modern microelectronic devices and circuits needs technologies with the highest level of packaging process, resolution and repeatability. Ink jet technology with micro-dimensions nozzle is year by year wider used for this purpose. It makes possible to dispense small volumes of a material in the range of tens picolitres. The printing electrically conductive microstructures require dispensed materials containing conductive particles as filler. Such demands are fulfilled by formulations containing silver particles with size dimensions less than 10 nm. Only this type of fluids working very stable during extremely long time and the highest acceleration during printing process. All aspects for this printing technology will be described in this paper as well as properties of conductive filler, inks and printing process phenomenon.
ISBN:1457721112
9781457721113
ISSN:2161-2528
DOI:10.1109/ISSE.2011.6053540