Fabrication of PMIA/fBN Dielectric Composite with Enhanced Breakdown Strength and Thermal Conductivity

• Published in: Materials science forum Vol. 960; pp. 256 - 262
• Main Authors: Hu, Zu Ming, Duan, Guang Yu
• Format: Journal Article
• Language: English
• Published: Pfaffikon Trans Tech Publications Ltd 01.06.2019
• Subjects: Composite materials; Conductivity; Dielectric breakdown; Dielectric loss; Dielectric properties; Dielectric strength; Fillers; Heat conductivity; Heat transfer; High temperature; Thermal conductivity; Dielectric Property; Breakdown Strength; BN; Thermal Conductivity; Poly(m-Phenyleneisophthalamide)(PMIA)
• ISSN: 0255-5476; 1662-9752; 1662-9752
• DOI: 10.4028/www.scientific.net/MSF.960.256

A high-temperature poly (m-phenyleneisophthalamide) (PMIA) dielectric composite was successfully manufactured with functionalized BN (fBN) fillers. Due to effective modification by KH-550, fBN particles evenly dispersed in PMIA matrix. The dielectric property, breakdown strength and thermal conductivity of PMIA/fBN dielectric composite were researched. The consequences indicate that fBN fillers can not only decrease the dielectric loss but also enhance the breakdown strength of PMIA/fBN dielectric composites. Furthermore, owing to the generated heat transfer pathways by fBN particles, the thermal conductivities improved from 0.23 W·m-1·K-1 of fBN-0 to 0.86 W·m-1·K-1 of fBN-30, demonstrating a significant improvement. These results present a novel method for fabricating high-temperature PMIA/fBN dielectric composites with improved breakdown strength and thermal conductivity.