Electro-Less Ni-P Plating Coating of In Situ TiCp/Al-4.5wt.%Cu Vomposites

In situ TiCp/Al-4.5wt.%Cu composites have been coated using an electro-less Ni-P plating technique. The morphology and composition of the plating coating have been examined by scanning electron microscopy, optical microscopy, and X-ray diffraction. The results indicated that the coating had a high-p...

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Bibliographic Details
Published inMaterials science forum Vol. 817; pp. 593 - 598
Main Authors Li, Gao Hong, Dong, Sheng Quan, Liang, Yan Feng
Format Journal Article
LanguageEnglish
Published Pfaffikon Trans Tech Publications Ltd 01.04.2015
Subjects
Metal-Matrix Composites (MMCs)
Coating
Electro-Less Plating
Amorphous Structure
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Summary:In situ TiCp/Al-4.5wt.%Cu composites have been coated using an electro-less Ni-P plating technique. The morphology and composition of the plating coating have been examined by scanning electron microscopy, optical microscopy, and X-ray diffraction. The results indicated that the coating had a high-phosphorus amorphous microstructure. The coatings microstructures showed significantly changes when the citric acid concentration in the chemical bath was varied in the range 16-20g/L.
Bibliography:Selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China
ISSN:0255-5476
1662-9752
1662-9752
DOI:10.4028/www.scientific.net/MSF.817.593