Excimer Laser Ablation of High Aspect Ratio Microvias Using a Novel Sensitizer-Enhanced Photopolymer

• Published in: Journal of microelectronics and electronic packaging Vol. 8; no. 2; pp. 66 - 71
• Main Authors: SARWAR, F, CHEN, Z, WU, J, WEBSTER, D. C, MARINOV, V. R
• Format: Journal Article
• Language: English
• Published: Washington, DC International Microelectronics and Packaging Society 01.04.2011
• Subjects: Applied sciences; Cross-disciplinary physics: materials science; rheology; Design. Technologies. Operation analysis. Testing; Electronics; Exact sciences and technology; Fundamental areas of phenomenology (including applications); Gas lasers including excimer and metal-vapor lasers; Integrated circuits; Laser deposition; Lasers; Materials science; Methods of deposition of films and coatings; film growth and epitaxy; Microelectronic fabrication (materials and surfaces technology); Optics; Physics; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; microvias; Aspect ratio; Negative resist; Microelectronic fabrication; laser ablation; Light sensitive polymer; negative tone photoresist; Thick film; Interconnection; Integrated circuit; Excimer lasers; Laser ablation technique; Microstructure; Photolithography; Sensitizer; Photoresist; Via hole
• ISSN: 1551-4897
• DOI: 10.4071/imaps.294

A new drop-in sensitizer has been developed for use with COTS negative tone photoresist to facilitate the laser fabrication of high aspect ratio microstructures in a thick film of photopolymer. Microvias with diameters as small as 50 μm have been successfully laser ablated in a 160 μm thick layer of the sensitized photoresist. Ablation rates of up to 86 nm/pulse have been achieved with an excimer laser.