Effect of Mold Temperature on Surface Segregation of Continuous Unidirectional Solidified Cu-Ag Alloy

The Cu–3%Ag alloy was prepared by continuous unidirectional solidification technique. The composition distribution of continuous unidirectional solidification Cu–3%Ag alloy was analyzed. The effect of different mold temperatures on the composition distribution of alloy was studied. The results show...

Full description

Saved in:
Bibliographic Details
Published inMaterials science forum Vol. 953; pp. 26 - 31
Main Authors Luo, Ji Hui, Deng, An Lin, Xiang, Li Juan, Zhang, Ling Ling, Han, Sun, Gan, Xun
Format Journal Article
LanguageEnglish
Published Pfaffikon Trans Tech Publications Ltd 01.05.2019
Subjects
Composition
Copper
Copper base alloys
Molds
Morphology
Solidification
Water drops
Surface Segregation
Continuous Unidirectional Solidification
Cu-Ag Alloy
Online AccessGet full text

Cover

More Information
Summary:The Cu–3%Ag alloy was prepared by continuous unidirectional solidification technique. The composition distribution of continuous unidirectional solidification Cu–3%Ag alloy was analyzed. The effect of different mold temperatures on the composition distribution of alloy was studied. The results show that when the mold temperature is low, continuous unidirectional solidification Cu–3%Ag alloy has surface segregation. The morphology of segregation phase mainly presents stripe and water drop shape. When the mold temperature is high, the surface segregation begins to decrease and eventually disappear.
Bibliography:Selected, peer reviewed papers from the International Conference on Materials Science and Industrial Applications (MSIA 2019), January 12-13, 2019, Wuhan, China
ISSN:0255-5476
1662-9752
1662-9752
DOI:10.4028/www.scientific.net/MSF.953.26