Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System

• Published in: IEEE transactions on components, packaging, and manufacturing technology (2011) Vol. 12; no. 5; pp. 883 - 886
• Main Authors: Li, Chenhui, Bhat, Srivathsa, Stabile, Ripalta, Song, Yuchen, Neumeyr, Christian, Raz, Oded
• Format: Journal Article
• Language: English
• Published: Piscataway IEEE 01.05.2022; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Alignment; Coupling; Couplings; Flip-chip bonding (FCB); Lenses; microlens; Mirrors; Optical waveguides; Photoresists; Resists; Silicon; silicon photonic waveguide; Tolerances; Vertical cavity surface emission lasers; Vertical cavity surface emitting lasers; vertical-cavity surface-emitting laser (VCSEL); Waveguide lasers; Waveguides; Wiring
• ISSN: 2156-3950; 2156-3985
• DOI: 10.1109/TCPMT.2022.3160149

We design an optical interface system for vertical coupling between vertical-cavity surface-emitting lasers (VCSELs) and 3-<inline-formula> <tex-math notation="LaTeX">\mu \text{m} </tex-math></inline-formula> silicon waveguides. The system includes a photoresist lens and a total internal reflection mirror, which allows for passive alignment and flip-chip bonding (FCB) of VCSELs. The simulated coupling loss is 0.7 dB, in optimal conditions, which increases to 1 dB when 3- and 20-<inline-formula> <tex-math notation="LaTeX">\mu \text{m} </tex-math></inline-formula> alignment tolerances are considered in lateral and longitudinal directions, respectively. The system is built by post-processing lens and metallic wiring on the backside of a 3-<inline-formula> <tex-math notation="LaTeX">\mu \text{m} </tex-math></inline-formula> silicon photonic platform. After FCB and embedding of the VCSELs, the system performance is characterized, and VCSEL-to-waveguide coupling efficiency of −7.5 dB is obtained.