Multi-layer topology optimization of dual-fluid convective heat transfer in printed circuit heat exchangers

• Published in: Applied thermal engineering Vol. 257; p. 124434
• Main Authors: Yang, Qirui, Chen, Li, Ke, Hanbing, Gu, Lingran, Zheng, Xinjian, Li, Sitong, Tao, Wenquan
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 15.12.2024
• Subjects: Heat transfer enhancement; Laminar and turbulent flow; Printed circuit heat exchanger; Topology optimization; Heat transfer enhancement; Topology optimization; Printed circuit heat exchanger; Laminar and turbulent flow
• ISSN: 1359-4311
• DOI: 10.1016/j.applthermaleng.2024.124434

•Topology optimization of printed circuit heat exchangers is studied.•The multi-layer model proposed can well predict the convective heat transfer.•The topology-optimized structures overwhelm seven existing structures.•A full-scale structure with improved thermal–hydraulic performance is designed.•The full-scale structure performs better under laminar and turbulent conditions. Optimizing channel configurations in printed circuit heat exchangers is essential for enhancing heat transfer and minimizing pumping power. The present study aims to optimize channel configurations by developing a multi-layer topology optimization (TO) model that simultaneously optimizes the fin structures in both the cold and hot fluid layers. The TO model directly integrates the heat transfer rate as the target function while using the pressure drop from an airfoil structure as the constraint. Counterintuitive channel configurations are generated by the TO model under various Reynolds numbers (Re). The evaluation under both laminar and turbulent conditions demonstrates that the TO-designed channel configuration outperforms conventional channel configurations including empty, airfoil, heatric, louver, modified louver, sine curve, and S-shaped designs. Compared with the airfoil structure, at Re = 300, the optimized structure can reduce pumping power by 17.0 % while increasing heat transfer by 10.8 %, and at Re = 20000 it reduces pumping power by 52.0 % and enhances heat transfer by 1.2 %. The present study introduces a promising method for designing novel printed circuit heat exchangers.