A Novel Approach for Thin 4H-SiC Foil Realization Using Controlled Spalling from a 4H-SiC Wafer

• Published in: Materials science forum Vol. 1124; pp. 35 - 41
• Main Authors: Pfusterschmied, Georg, Schmid, Ulrich, Leitgeb, Markus, Wahid, Shan Nizam
• Format: Journal Article
• Language: English
• Published: Pfaffikon Trans Tech Publications Ltd 21.08.2024
• Subjects: Chemical etching; Silicon carbide; Spalling; 4H-SiC; Ni Plating; Thin Foil; MAPCE; Controlled Spalling

Porosifying the surface of a single crystalline silicon carbide (4H-SiC) wafer with the means of metal assisted photo chemical etching (MAPCE) promotes the adhesion of an electroplated nickel (Ni) layer. By utilizing a mechanical peel-off process, a Ni layer with tailored mechanical stress is peeled...