Evaluating interfacial bonding quality of multilayered structure based on ultrasonic testing technology

Abstract An ultrasonic evaluation method of interfacial bonding quality from layered structures is proposed for enhancing the testing accuracy. The ultrasonic reflection and transmission characteristic is theoretically analyzed, which focus on the different quality of the single and double bonding i...

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Bibliographic Details
Published inMeasurement science & technology Vol. 34; no. 9; p. 95117
Main Authors Li, Puxin, Wang, Xingguo, Li, Xiaogao, Shen, Guolang, Ma, Chengwen, Huang, Zhicheng, Su, Shiyu
Format Journal Article
LanguageEnglish
Published 01.09.2023
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Summary:Abstract An ultrasonic evaluation method of interfacial bonding quality from layered structures is proposed for enhancing the testing accuracy. The ultrasonic reflection and transmission characteristic is theoretically analyzed, which focus on the different quality of the single and double bonding interface with spring-type. The reflection coefficient and transmission coefficient mathematic models, which include multiple parameters, are derived from the transfer matrix. Taking the first, second, and the double bonding interface as the research objects, respectively, two types of resonant frequencies have been presented by numerical solving the model, namely, the first type resonance frequency (RFI) and the second type resonance frequency (RFII). The results show that the interval of the RFⅠ is related to medium thickness of the maximum acoustic impedance. Similarly, the interval of the RFⅡ depends on other layers’ thickness. In addition, the transmission coefficient shows a change in different trends with the bonding interface gradually tending to rigid. When the adhesive layer thickness is sufficiently small compared with the wavelength, the reflection coefficient shows many local minima points at a certain frequencies range, the frequency of local minimum point increases with the increase of the stiffness coefficient. The experimental results are in good agreement with the numerical solution results and finite element analysis results.
ISSN:0957-0233
1361-6501
DOI:10.1088/1361-6501/acdb8e