Study on External Stress Type Whisker and Crystal Orientation for Sn Plated Film

Evaluation of external stress-type whisker growth on Sn-plated films after reflow and after preparation under periodic reverse current revealed short whiskers, which were evaluated using ball intender method. Furthermore, XRD analysis results confirmed the presence of multiple crystal planes.

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Bibliographic Details
Published inHyōmen gijutsu Vol. 72; no. 12; pp. 710 - 712
Main Authors IWAMOTO, Hiroyuki, NAKAMURA, Katsuji, MUNEKATA, Osamu, YOSHIHARA, Sachio
Format Journal Article
LanguageJapanese
English
Published Tokyo The Surface Finishing Society of Japan 01.12.2021
Japan Science and Technology Agency
Subjects
Crystal Orientation
Crystal structure
External Stress
Sn Whisker
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Summary:Evaluation of external stress-type whisker growth on Sn-plated films after reflow and after preparation under periodic reverse current revealed short whiskers, which were evaluated using ball intender method. Furthermore, XRD analysis results confirmed the presence of multiple crystal planes.
ISSN:0915-1869
1884-3409
DOI:10.4139/sfj.72.710