Enhancement of anti-oxidation and tensile strength of nanotwinned Cu foils by preferential Ni electrodeposition

• Published in: Electrochimica acta Vol. 500; p. 144769
• Main Authors: Lee, Kang-Ping, Tran, Dinh-Phuc, Chen, Bo-Yan, Lin, Yi-Quan, Li, Chen-Ning, Huang, Jian-Yuan, Chen, Hsuan-Chih, Chen, Ruei-Yu, Chen, Chih
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.10.2024
• Subjects: Nanotwinned Cu; Nanotwinned Cu-Ni; Overpotential; Oxidation resistance; Tensile strength; Nanotwinned Cu; Nanotwinned Cu-Ni; Overpotential; Oxidation resistance; Tensile strength
• ISSN: 0013-4686
• DOI: 10.1016/j.electacta.2024.144769

In this study, Ni was employed to enhance the mechanical properties of nanotwinned copper (NT-Cu) foils due to its excellent oxidation resistance and compatibility with Cu. The tensile strength of the NT-Cu foils was enhanced 12.6 % (752.8 to 847.3 MPa) by Ni co-electrodeposition. During the electroplating, it was found that Ni ions inhibited the Cu growth, causing the reduction potential (overpotential) to shift in the negative direction. It resulted in a reduced deposition rate and decreased the twin spacing of the foils. Additionally, Ni ions acted as impurities for the grain refinement. Time of flight secondary ion mass spectrometry (TOF-SIMS) results indicated that Ni atoms were deposited on the top and bottom of the foils due to the limiting current density of Ni. The NT-Cu-Ni exhibited low roughness and performed superior resistance to oxidation compared to the NT-Cu. X-ray photoelectron spectroscopy (XPS) was also utilized to characterize the oxidation of the Cu (Ni) alloys. These mechanisms contributed to high strength, low resistivity, and excellent oxidation resistance of the NT-Cu-Ni foils for future battery materials.