On direct-current magnetron sputtering at industrial conditions with high ionization fraction of sputtered species
In the industry, there is a preference for robust and technologically straightforward solutions that can deliver desired products at reasonable costs. This study introduces a reliable, robust, and cost-effective ion-assisted thin film growth technique called moving focused magnetic field magnetron s...
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Published in | Surface & coatings technology Vol. 487; p. 131028 |
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Main Authors | , , , , , |
Format | Journal Article |
Language | English |
Published |
Elsevier B.V
15.07.2024
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Subjects | |
Online Access | Get full text |
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Summary: | In the industry, there is a preference for robust and technologically straightforward solutions that can deliver desired products at reasonable costs. This study introduces a reliable, robust, and cost-effective ion-assisted thin film growth technique called moving focused magnetic field magnetron sputtering. At the core of this technology lies the generation of dense plasma within a small area of the target and the controlled movement of this plasma across the entire target surface. The deposition process, powered by a direct current generator, behaves similarly to high-power impulse magnetron sputtering and yields coatings with properties comparable to those produced by this method. Notably, this study marks the first application of an ion meter to measure the ionized metal flux fraction of sputtered titanium at industrial conditions, revealing values of up to 34% measured at the substrate position.
•A comparative study was presented between two industrial technologies, DCMS and F-MS.•For industrial DCMS, the IMFF reaches 20% for 25 kW at the substrate position.•For industrial F-MS, the IMFF achieves up to 34% for 23 kW at the substrate.•F-MS technology exhibits a more significant influence on film texture than DCMS.•The first application of an ion meter to measure IMFF in industrial conditions. |
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ISSN: | 0257-8972 |
DOI: | 10.1016/j.surfcoat.2024.131028 |