Computational parametric study of latent melting heat storage
This paper presents a numerical study of the melting process of a phase change material for the cooling of a heat source “electronic component”. The latter is protruding and mounted on a substrate "motherboard" in the center of the bottom wall of a rectangular enclosure. The enclosure is f...
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Published in | MATEC Web of Conferences Vol. 286; p. 8008 |
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Main Authors | , , |
Format | Journal Article Conference Proceeding |
Language | English |
Published |
Les Ulis
EDP Sciences
2019
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Subjects | |
Online Access | Get full text |
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Summary: | This paper presents a numerical study of the melting process of a phase change material for the cooling of a heat source “electronic component”. The latter is protruding and mounted on a substrate "motherboard" in the center of the bottom wall of a rectangular enclosure. The enclosure is filled completely with PCM. A 2D non-dimensional mathematical model is developed based on the conservation equations of mass, momentum and energy. The enclosure aspect ratio ‘A’ effect on the thermal and hydrodynamic behavior of the PCM-based heat sink is investigated. |
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ISSN: | 2261-236X 2274-7214 2261-236X |
DOI: | 10.1051/matecconf/201928608008 |