Single‐step preparation of intrinsic solid–solid phase change materials with excellent anti‐leakage and form‐stable performance

• Published in: Journal of applied polymer science Vol. 141; no. 35
• Main Authors: Xiao, Changren, Yin, Xinpeng, Chen, Jiaqi, Wang, Yanshuo, Liao, Wenming, Zhang, Jiangyun, Jiang, Wenzhao, Tu, Chaoqun
• Format: Journal Article
• Language: English
• Published: Hoboken, USA John Wiley & Sons, Inc 15.09.2024; Wiley Subscription Services, Inc
• Subjects: antil‐leakage performance; Chains (polymeric); Chemical bonds; copolymers; Crosslinking; Crystallization; Density; Dimensional changes; form‐stability; Free radical polymerization; Free radicals; Latent heat; Leakage; Molecular chains; Molecular structure; Phase change materials; Polymers; Raw materials; Solid phases; solid‐solid phase change materials; Thermal stability; Tightness
• ISSN: 0021-8995; 1097-4628
• DOI: 10.1002/app.55876

Phase change materials (PCM) often encounter severe problems of leakage and shape collapse concerns. Chemical modification methods, utilizing chemical bonds to bind phase change molecular chains, have the potential to address the above‐mentioned problems radically. However, this approach often entails the use of expensive raw materials and complex processes. Therefore, a simple one‐pot preparation method had been reported using earth‐abundant and inexpensive octadecyl methacrylate (OMA) and 1,6‐hexanediol diacrylate (HD) as raw materials to prepare PCM with a molecular structure of cross‐linked polymer main chains and phase change side chains through free radical polymerization. Owing to the three‐dimensional polymer main chain structure, it exhibited excellent leakage‐proof performance, maintaining its form‐stable nature at 70°C with no obvious leakage observed during the phase change process, confirming it to be an excellent intrinsic solid–solid PCM (SSPCM). Additionally, the introduction of the cross linking segment significantly improves its thermal stability, and the 50% degradation temperature increased significantly from 228.8 to 355.9°C. Moreover, the latent heat increased with the decrease of the crosslinking density until the molar ratio of HD/OMA was reduced to 1/40 and then tended to reach constant. At the optimal ratio the latent heat of SSPCM can reach 88.23 J g−1. Excessive crosslinking density will affect the stacking tightness of molecular chains during the crystallization process, thereby reducing the latent heat. Novel solid‐solid PCM with excellent thermal stability and suitable thermo‐physical properties was prepared via single‐step.