The impact of Al2O3 back interface layer on low-temperature growth of ultrathin Cu(In,Ga)Se2 solar cells

With reducing the absorber layer thickness and processing temperature, the recombination at the back interface is severe, which both can result in the decrease of open-circuit voltage and fill factor. In this paper, we prepare Al 2 O 3 by atomic layer deposition (ALD), and investigate the effect of...

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Published inOptoelectronics letters Vol. 14; no. 5; pp. 363 - 366
Main Authors Liu, Yang, Liu, Wei, Chen, Meng-Xin, Shi, Si-Han, He, Zhi-Chao, Gong, Jin-Long, Wang, Tuo, Zhou, Zhi-Qiang, Liu, Fang-Fang, Sun, Yun, Xu, Shu
Format Journal Article
LanguageEnglish
Published Tianjin Tianjin University of Technology 01.09.2018
Springer Nature B.V
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Summary:With reducing the absorber layer thickness and processing temperature, the recombination at the back interface is severe, which both can result in the decrease of open-circuit voltage and fill factor. In this paper, we prepare Al 2 O 3 by atomic layer deposition (ALD), and investigate the effect of its thickness on the performance of Cu(In,Ga)Se 2 (CIGS) solar cell. The device recombination activation energy ( E A ) is increased from 1.04 eV to 1.11 eV when the thickness of Al 2 O 3 is varied from 0 nm to 1 nm, and the height of back barrier is decreased from 48.54 meV to 38.05 meV. An efficiency of 11.57 % is achieved with 0.88-μm-thick CIGS absorber layer.
ISSN:1673-1905
1993-5013
DOI:10.1007/s11801-018-8036-7