MICRO-PHASE SAEPARATION IN EPOXY RESIN WATERBORNE PARTICLES DURING CURING PROCESS

Sub-micron sized phenolic epoxy resin waterborne particles were prepared by phase inversion emulsification. Micro-phase separation occurred during the curing process at high temperature. The as-prepared samples possessed one glass transition temperature （Tg） and two exothermal processes during DSC h...

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Bibliographic Details
Published inChinese journal of polymer science Vol. 23; no. 5; pp. 561 - 566
Main Author Xi-yan Liu Dong Qiu Mei-li Guo Zhen-zhong Yang
Format Journal Article
LanguageEnglish
Published 01.09.2005
Subjects
乳化作用
形态特征
环氧化物
结构表征
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Summary:Sub-micron sized phenolic epoxy resin waterborne particles were prepared by phase inversion emulsification. Micro-phase separation occurred during the curing process at high temperature. The as-prepared samples possessed one glass transition temperature （Tg） and two exothermal processes during DSC heating scannings. After being thermally treated above the exothermal peak temperature, they possessed two glass transition temperatures with the disappearance of exothermal peaks, whilst a core/shell structure was formed. This was likely related with the outward diffusion of reactive oligomers to the outer layer of particles.
Bibliography:Waterborne dispersions
O632.7
Curing process
Phenolic epoxy resin
Micro-phase separation
Curing process; Phenolic epoxy resin; Waterborne dispersions; Micro-phase separation; Core/shell structure.
Core/shell structure.
11-2015/O6
ISSN:0256-7679
1439-6203
DOI:10.1142/S0256767905000771