The Distinguished Charge-Trapping Capability of the Memory Device with Al2O3-Cu2O Composite as the Charge Storage Layer
A memory device Si/Al2O3/Al2O3-Cu2O/Al2O3/Pt is fabricated by using atomic layer deposition and r~magnetron sputtering techniques. The memory device including the composite of Al2O3 and Cu2O as the charge storage layer shows a distinguished charge trapping capability. At a working voltage of ±11 V a...
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Published in | 中国物理快报:英文版 no. 2; pp. 146 - 148 |
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Main Author | |
Format | Journal Article |
Language | English |
Published |
01.02.2014
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Subjects | |
Online Access | Get full text |
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