Engineering electronic inks for bioelectronics with tunable directional mechanics

• Published in: Matter Vol. 7; no. 8; pp. 2700 - 2704
• Main Authors: Gonzalez, Jair, Lee, Chihtong, Talloo, Komal, Manjarrez, Victoria, Avila, Raudel
• Format: Journal Article
• Language: English
• Published: Elsevier Inc 07.08.2024
• ISSN: 2590-2385; 2590-2385
• DOI: 10.1016/j.matt.2024.05.033

Bioelectronics systems with soft-rigid electronic layouts that can alter their mechanics in response to thermal stimuli offer rapid, reversible, and conformal integration with dynamic tissues like skin. By leveraging body-temperature gradients and phase transitions, Kwon et al. optimized the rheological and electromechanical properties of metallic (gallium-copper) composite inks to print highly customizable bioelectronics with reversible bidirectional stiffness, high conductivity, and improved patternability. The findings, published in Science Advances, introduce a promising material alternative for precise and simplified fabrication of freeform bioelectronic systems that increase the design space for mechanically transformative applications in wearable and implantable bioelectronic platforms. Bioelectronics systems with soft-rigid electronic layouts that can alter their mechanics in response to thermal stimuli offer rapid, reversible, and conformal integration with dynamic tissues like skin. By leveraging body-temperature gradients and phase transitions, Kwon et al. optimized the rheological and electromechanical properties of metallic (gallium-copper) composite inks to print highly customizable bioelectronics with reversible bidirectional stiffness, high conductivity, and improved patternability. The findings, published in Science Advances, introduce a promising material alternative for precise and simplified fabrication of freeform bioelectronic systems that increase the design space for mechanically transformative applications in wearable and implantable bioelectronic platforms.