170-GHz transceiver with on-chip antennas in SiGe technology
A single-chip transceiver with on-die transmit and receive antennas, Rx and Tx amplifiers, 165-GHz oscillator and static frequency divider is reported in a SiGe HBT process with f T /f MAX of 270 GHz/340 GHz. This marks the highest frequency transceiver in silicon and the highest level of functional...
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Published in | 2008 IEEE Radio Frequency Integrated Circuits Symposium pp. 637 - 640 |
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Main Authors | , , , , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
01.06.2008
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Subjects | |
Online Access | Get full text |
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Summary: | A single-chip transceiver with on-die transmit and receive antennas, Rx and Tx amplifiers, 165-GHz oscillator and static frequency divider is reported in a SiGe HBT process with f T /f MAX of 270 GHz/340 GHz. This marks the highest frequency transceiver in silicon and the highest level of functional integration above 100 GHz in any semiconductor technology. The downconversion gain peaks at -5 dB and the transmit power is -5 dBm when measured at the transceiver pads. Both degrade by approximately 25 dB when measured above the antennas of the transceiver with on-die antennas. The experimental performance of dipole (with and without floating metal strips) and patch antennas is also investigated. The measured 15-dB gain of a standalone amplifier is centered at 170 GHz and remains higher than 10 dB from 160 GHz to 180 GHz while the saturated output power is 0 dBm at 165 GHz. |
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ISBN: | 9781424418084 1424418089 |
ISSN: | 1529-2517 2375-0995 |
DOI: | 10.1109/RFIC.2008.4561518 |