170-GHz transceiver with on-chip antennas in SiGe technology

A single-chip transceiver with on-die transmit and receive antennas, Rx and Tx amplifiers, 165-GHz oscillator and static frequency divider is reported in a SiGe HBT process with f T /f MAX of 270 GHz/340 GHz. This marks the highest frequency transceiver in silicon and the highest level of functional...

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Bibliographic Details
Published in2008 IEEE Radio Frequency Integrated Circuits Symposium pp. 637 - 640
Main Authors Laskin, E., Tang, K.W., Yau, K.H.K., Chevalier, P., Chantre, A., Sautreuil, B., Voinigescu, S.P.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.06.2008
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Summary:A single-chip transceiver with on-die transmit and receive antennas, Rx and Tx amplifiers, 165-GHz oscillator and static frequency divider is reported in a SiGe HBT process with f T /f MAX of 270 GHz/340 GHz. This marks the highest frequency transceiver in silicon and the highest level of functional integration above 100 GHz in any semiconductor technology. The downconversion gain peaks at -5 dB and the transmit power is -5 dBm when measured at the transceiver pads. Both degrade by approximately 25 dB when measured above the antennas of the transceiver with on-die antennas. The experimental performance of dipole (with and without floating metal strips) and patch antennas is also investigated. The measured 15-dB gain of a standalone amplifier is centered at 170 GHz and remains higher than 10 dB from 160 GHz to 180 GHz while the saturated output power is 0 dBm at 165 GHz.
ISBN:9781424418084
1424418089
ISSN:1529-2517
2375-0995
DOI:10.1109/RFIC.2008.4561518