Thermal ageing monitoring in Cu Al intermetallic joints through electrical resistance drift: Comparative study of lifetime potential in pure and alloyed copper wires

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Published inMicroelectronics and reliability Vol. 168; p. 115660
Main Authors Carluccio, R., Mancaleoni, A., Losacco, G., Villa, R., Serafini, A., Guarino, L., Dellasega, D.
Format Journal Article
LanguageEnglish
Published 01.05.2025
Online AccessGet full text
ISSN0026-2714
DOI10.1016/j.microrel.2025.115660

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ArticleNumber 115660
Author Mancaleoni, A.
Guarino, L.
Carluccio, R.
Serafini, A.
Villa, R.
Dellasega, D.
Losacco, G.
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Cites_doi 10.1016/j.microrel.2007.06.008
10.1108/13565360910923115
10.3390/cryst3030391
10.1109/TCAPT.2003.815121
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Title Thermal ageing monitoring in Cu Al intermetallic joints through electrical resistance drift: Comparative study of lifetime potential in pure and alloyed copper wires
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