Thermal ageing monitoring in Cu Al intermetallic joints through electrical resistance drift: Comparative study of lifetime potential in pure and alloyed copper wires

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Bibliographic Details
Published inMicroelectronics and reliability Vol. 168; p. 115660
Main Authors Carluccio, R., Mancaleoni, A., Losacco, G., Villa, R., Serafini, A., Guarino, L., Dellasega, D.
Format Journal Article
LanguageEnglish
Published 01.05.2025
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ISSN:0026-2714
DOI:10.1016/j.microrel.2025.115660