A novel thermal buffer utilizing dissolution heat to cooling electronic devices in isolated environment

• Published in: Journal of energy storage Vol. 101; p. 114002
• Main Authors: Liang, Cong, Bai, Xiao-Li, Qiu, Yong-Jun, Liu, Ze-Zheng, Ding, Bin
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 10.11.2024
• Subjects: CO(NH2)2; Dissolution heat; Electronic devices; Isolated environment; Thermal buffer; Dissolution heat; Thermal buffer; Electronic devices; CO(NH2)2; Isolated environment
• ISSN: 2352-152X
• DOI: 10.1016/j.est.2024.114002

A thermal buffer with high cooling capacity can rapidly absorb heat, preventing electronic devices in isolated conditions from overheating and extending their working time. This paper introduced the design of a thermal buffer featuring a meltable partition to utilize dissolution heat and conducted experimental investigations into the endothermic characteristics of CO(NH2)2 dissolving in water under different solute proportions, dissolving temperatures, and heat fluxes. The results demonstrated that natural convection was suppressed by the high viscosity of the CO(NH2)2 solution, preventing the cooling capacity of the thermal buffer from achieving the expected performance. Fortunately, the utilization efficiency of sensible heat was improved by movement and higher dissolving temperatures, significantly enhancing the cooling capacity. It should be noted that the cooling capacity of a thermal buffer filled with NH4NO3/H2O can surpass that of paraffin by >12 times at q = 1 W·cm−2 and tp = 70 °C, attributed to the advantages of the endothermic reaction, including a replaceable dissolving temperature, short dissolving time, and considerable dissolution heat. Moreover, these advantages are significantly amplified with increased heat flux and decreased operating temperatures of electronic devices. These insights deepen our understanding of the endothermic characteristics of solute dissolution in water, providing valuable guidance for designing thermal buffers with superior cooling capacity. •Endothermic characteristics of CO(NH2)2 dissolving in water is explored.•Effects of solute proportion, dissolving temperature and heat flux are explored.•Cooling capacity can be improved by increasing dissolving temperature.•Cooling capacity of NH4NO3/H2O can surpass that of paraffin by >12 times