3D Microelectronics: 3D Self‐Assembled Microelectronic Devices: Concepts, Materials, Applications (Adv. Mater. 15/2020)

Future microelectronics will utilize 3D space offering higher performance, high density, and novel features. In article number 1902994, inspired by natural selfassembly processes, Daniil Karnaushenko, Feng Zhu, Oliver G. Schmidt, and co‐workers provide a vision as to how 3D microelectronics should b...

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Bibliographic Details
Published inAdvanced materials (Weinheim) Vol. 32; no. 15
Main Authors Karnaushenko, Daniil, Kang, Tong, Bandari, Vineeth K., Zhu, Feng, Schmidt, Oliver G.
Format Journal Article
LanguageEnglish
Published 16.04.2020
Subjects
3D geometry
microelectronics
self‐assembly
shapeable materials
strain engineering
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Summary:Future microelectronics will utilize 3D space offering higher performance, high density, and novel features. In article number 1902994, inspired by natural selfassembly processes, Daniil Karnaushenko, Feng Zhu, Oliver G. Schmidt, and co‐workers provide a vision as to how 3D microelectronics should be developed in the near future. History as well as the current state of art are reviewed for microelectronic devices pointing at novel monolithic wafer scale self‐assembly methods explored for rolled‐up, polygonal, and pop‐up microelectronics.
ISSN:0935-9648
1521-4095
DOI:10.1002/adma.202070120