Introduction to the Special Issue on Interface Reliability II

Saved in:
Bibliographic Details
Published inIEEE transactions on device and materials reliability Vol. 4; no. 2; pp. 127 - 128
Main Authors Blish, R., Christou, A., Samuelson, G., Thomas, B.
Format Magazine Article
LanguageEnglish
Published New York IEEE 01.06.2004
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Adhesives
Chemical technology
Copper
Delamination
Heating
Semiconductor device reliability
Special issues and sections
Tensile stress
Thermal expansion
Thermal stresses
Online AccessGet full text

Cover

More Information
ISSN:1530-4388
1558-2574
DOI:10.1109/TDMR.2004.831988