The Resistance of Space-Quality Solder Joints to Thermal Fatigue
An evaluation programme involving the extensive thermal cycling of component-assembled printed circuit boards has been undertaken to assess the suitability of ESA-approved hand-soldering techniques for use on long-life satellites. The modes of joint degradation are discussed and the metallurgical ch...
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| Published in | Circuit world Vol. 6; no. 1; pp. 16 - 27 |
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| Main Author | |
| Format | Journal Article |
| Language | English |
| Published |
MCB UP Ltd
01.04.1979
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| Online Access | Get full text |
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| Summary: | An evaluation programme involving the extensive thermal cycling of component-assembled printed circuit boards has been undertaken to assess the suitability of ESA-approved hand-soldering techniques for use on long-life satellites. The modes of joint degradation are discussed and the metallurgical changes that result from material thermal expansion mismatch and repeated strain within the solder alloy (63% tin, 37% lead) are highlighted by photomicroscopy. |
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| ISSN: | 0305-6120 1758-602X |
| DOI: | 10.1108/eb043602 |