Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures

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Bibliographic Details
Published inMicroelectronics and reliability Vol. 150; p. 115105
Main Authors Li, W.Y., Chen, C.T., Ueshima, M., Kobatake, T., Suganuma, K.
Format Journal Article
LanguageEnglish
Japanese
Published 01.11.2023
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ISSN:0026-2714
DOI:10.1016/j.microrel.2023.115105