Instantaneous thermal fracture behaviors of a bimaterial with a penny-shaped interface crack via generalized fractional heat transfer

• Published in: Applied mathematical modelling Vol. 132; pp. 724 - 750
• Main Authors: Zhang, Xue-Yang, Hu, Zhen-Liang, Li, Xian-Fang, Yang, Wen-Zhi
• Format: Journal Article
• Language: English
• Published: Elsevier Inc 01.08.2024
• Subjects: Dundurs' parameters; Generalized fractional heat conduction; Goodier's thermoelastic displacement potential; Interface crack; Thermal stress intensity factor; Wave-like memory effects; Thermal stress intensity factor; Dundurs' parameters; Interface crack; Generalized fractional heat conduction; Goodier's thermoelastic displacement potential; Wave-like memory effects
• ISSN: 0307-904X
• DOI: 10.1016/j.apm.2024.05.003

In the high-temperature environment, a larger thermal expansion mismatch of a bimaterial leads to pronounced thermal stresses and interface crack growth. In this paper, a generalized fractional heat conduction model is used to determine the instantaneous thermal fracture behaviors of a bimaterial interface crack. An axisymmetric thermoelastic problem is solved with the aid of Goodier's thermoelastic displacement potential and Love's potential functions. A mixed initial-boundary value problem is then converted to a singular integral equation of second kind by using the Hankel and Laplace integral transforms. Numerical results of the intensity factors of heat flux and thermal stresses are evaluated using Stehfest's Laplace inversion scheme. The influence of fractional kernel functions with power and exponential law are analyzed, respectively, for aluminum-steel and steel-epoxy, respectively. The thermal stress intensity factors exhibit more wave-like behaviors based on Riemann-Liouville and Atangana-Baleanu models which is different from Caputo-Fabrizio and the complete diffusion model. •An interface crack between dissimilar materials is analyzed.•Goodier's and Love's potential functions are utilized for solving the problem.•Transient heat flux and thermal stress intensity factors are investigated.•Characteristics for various fractional heat flux kernel are considered.