Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability

In the original article, there is an error in Fig. 1. Following is the corrected Fig. 1.

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Bibliographic Details
Published inJournal of electronic materials Vol. 49; no. 7; pp. 4466 - 4467
Main Authors Kelly, Marion Branch, Maity, Tapabrata, Nazmus Sakib, A. R., Frear, D. R., Chawla, Nikhilesh
Format Journal Article
LanguageEnglish
Published New York Springer US 01.07.2020
Springer Nature B.V
Subjects
Characterization and Evaluation of Materials
Chemistry and Materials Science
Correction
Electronics and Microelectronics
Instrumentation
Lead free
Materials Science
Optical and Electronic Materials
Solid State Physics
Surface finish
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More Information
Summary:In the original article, there is an error in Fig. 1. Following is the corrected Fig. 1.
Bibliography:correction
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-020-08156-0