A Classification and Segmentation Model for Diamond Abrasive Grains Based on Improved Swin-Unet-SAM

The detection of abrasive grain images in diamond tools serves as the foundation for assessing the overall condition of the tools, encompassing crucial aspects of diamond abrasive grains like the quantity, size, morphology, and distribution. Given the intricate background textures and reflective cha...

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Bibliographic Details
Published inElectronics (Basel) Vol. 13; no. 21; p. 4213
Main Authors Lin, Yanfen, Fan, Tinghao, Fang, Congfu
Format Journal Article
LanguageEnglish
Published Basel MDPI AG 01.11.2024
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Summary:The detection of abrasive grain images in diamond tools serves as the foundation for assessing the overall condition of the tools, encompassing crucial aspects of diamond abrasive grains like the quantity, size, morphology, and distribution. Given the intricate background textures and reflective characteristics exhibited by diamond images, diamond detection and segmentation pose a significant challenge. Recently, numerous defect detection methods based on machine learning and deep learning have emerged. However, several issues persist, such as detection accuracy and the interference caused by intricate background textures. The present work demonstrates an efficient classification and segmentation network algorithm that combines Swin-Unet with SAM (Segment Anything Model) to alleviate the existing problems. Specifically, four embedding structures were devised to bridge the two models for iterative training. The transformer blocks within the Swin-Unet model were enhanced to facilitate classification and coarse segmentation, and the mask structure in SAM was refined to enable fine segmentation. The experimental results show that under a small sample dataset with complex background textures, the average index values of ACC (accuracy), SE (Sensitivity), and DSC (Dice Similarity Coefficient) for the classification and segmentation of diamond abrasive grains reached 98.7%, 92.5%, and 85.9%, respectively. Compared with the model before improvement, its ACC, SE and DSC increased by 1.2%, 15.9%, and 7.6%, respectively. The test results, based on four different datasets, consistently indicated that this model has excellent segmentation performance and robustness and has great application potential in the industrial field.
ISSN:2079-9292
2079-9292
DOI:10.3390/electronics13214213