Erratum to: Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys
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Published in | Journal of electronic materials Vol. 41; no. 4; p. 800 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
Boston
Springer US
01.04.2012
Springer Nature B.V |
Subjects | |
Online Access | Get full text |
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ISSN: | 0361-5235 1543-186X |
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DOI: | 10.1007/s11664-012-1993-x |