Interfacial Energy Effect on the Distribution of Ag 3 Sn in Full Intermetallic Joints

Intermetallics, including Cu 6 Sn 5 , Ni 3 Sn 4 , and Ag 3 Sn, are to be used for structural applications in microjoints of three‐dimensional integrated circuits. However, the phase distribution behavior of Ag 3 Sn particles in Cu 6 Sn 5 is very different from that in Ni 3 Sn 4 . It is shown for the...

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Published inAdvanced engineering materials Vol. 17; no. 11; pp. 1528 - 1531
Main Authors Yang, Ting‐Li, Zhu, Zi‐Xuan, Yu, Jen‐Jui, Lin, Yan‐Fu, Kao, C. Robert
Format Journal Article
LanguageEnglish
Published 01.11.2015
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Summary:Intermetallics, including Cu 6 Sn 5 , Ni 3 Sn 4 , and Ag 3 Sn, are to be used for structural applications in microjoints of three‐dimensional integrated circuits. However, the phase distribution behavior of Ag 3 Sn particles in Cu 6 Sn 5 is very different from that in Ni 3 Sn 4 . It is shown for the first time that the interfacial free energies between these intermetallics are responsible for this difference. It is found that the interfacial energy between Cu 6 Sn 5 and Ag 3 Sn is very low, even lower than the Cu 6 Sn 5 grain boundary energy.
ISSN:1438-1656
1527-2648
DOI:10.1002/adem.201500153