Extendibility Study of Conventional IPA Drying Process From Dynamic Fluid Model for Pattern Collapse

Pattern stiction of nanostructures during drying has become an issue with device miniaturization, and pattern collapse models have been discussed to solve this problem. These models take into account the surface tension of the liquid and the mechanical strength of the structure, but the drying rate,...

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Bibliographic Details
Published inECS transactions Vol. 108; no. 4; pp. 145 - 153
Main Authors Otsuji, Masayuki, Tanaka, Takayoshi, Iwasaki, Akihisa, Takahashi, Hiroaki, Okuno, Yasutoshi
Format Journal Article
LanguageEnglish
Published The Electrochemical Society, Inc 20.05.2022
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Summary:Pattern stiction of nanostructures during drying has become an issue with device miniaturization, and pattern collapse models have been discussed to solve this problem. These models take into account the surface tension of the liquid and the mechanical strength of the structure, but the drying rate, which is effective in suppressing pattern collapse, has not been discussed. We propose a new model that incorporates the drying rate and discuss its extensibility to the conventional IPA drying process.
ISSN:1938-5862
1938-6737
DOI:10.1149/10804.0145ecst