Diffusion Resistance of Low Temperature Chemical Vapor Deposition Dielectrics for Multiple Through Silicon Vias on Bumpless Wafer-on-Wafer Technology

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Bibliographic Details
Published inJapanese Journal of Applied Physics Vol. 50; no. 5S1; p. 5
Main Authors Kitada, Hideki, Maeda, Nobuhide, Fujimoto, Koji, Mizushima, Yoriko, Nakata, Yoshihiro, Nakamura, Tomoji, Ohba, Takayuki
Format Journal Article
LanguageEnglish
Japanese
Published 01.05.2011
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ISSN:0021-4922
1347-4065
DOI:10.7567/JJAP.50.05ED02