56th Electronic Components and Packaging Conference (ECPC 2006)

Provides notice of upcoming conference events of interest to practitioners and researchers.

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Bibliographic Details
Published inIEEE transactions on electronics packaging manufacturing Vol. 29; no. 2; p. 137
Format Journal Article
LanguageEnglish
Published New York IEEE 01.04.2006
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Online AccessGet full text
ISSN1521-334X
1558-0822
DOI10.1109/TEPM.2006.876552

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Summary:Provides notice of upcoming conference events of interest to practitioners and researchers.
Bibliography:ObjectType-Article-2
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ISSN:1521-334X
1558-0822
DOI:10.1109/TEPM.2006.876552