Preparation of Low-resistive and Adhesive Metallic Cu layer on Glass Substrate by Chemical Reactions
A metallic Cu layer was fabricated on a glass substrate using chemical bath deposition of Cu(OH)2/Cu(O,S)bilayer in aqueous solutions containing copper(II)nitrate hydrate, ammonium nitrate, and thiourea or urea, followed by chemical reduction in a sodium borohydride solution. The Cu layer possessed...
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Published in | Hyōmen gijutsu Vol. 75; no. 1; pp. 40 - 42 |
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Main Authors | , , , , , |
Format | Journal Article |
Language | Japanese English |
Published |
Tokyo
The Surface Finishing Society of Japan
01.01.2024
Japan Science and Technology Agency |
Subjects | |
Online Access | Get full text |
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Summary: | A metallic Cu layer was fabricated on a glass substrate using chemical bath deposition of Cu(OH)2/Cu(O,S)bilayer in aqueous solutions containing copper(II)nitrate hydrate, ammonium nitrate, and thiourea or urea, followed by chemical reduction in a sodium borohydride solution. The Cu layer possessed resistance of 0.68 Ω/□ and maximum peeling strength of 13.4 N/cm. |
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ISSN: | 0915-1869 1884-3409 |
DOI: | 10.4139/sfj.75.40 |