Preparation of Low-resistive and Adhesive Metallic Cu layer on Glass Substrate by Chemical Reactions

A metallic Cu layer was fabricated on a glass substrate using chemical bath deposition of Cu（OH）2/Cu（O,S）bilayer in aqueous solutions containing copper（II）nitrate hydrate, ammonium nitrate, and thiourea or urea, followed by chemical reduction in a sodium borohydride solution. The Cu layer possessed...

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Bibliographic Details
Published inHyōmen gijutsu Vol. 75; no. 1; pp. 40 - 42
Main Authors IZAKI, Masanobu, HASHIMOTO, Yui, IMAHORI, Kosuke, INABA, Rieru, Loon, Khoo Pei, TAKAHASHI, Hisaya
Format Journal Article
LanguageJapanese
English
Published Tokyo The Surface Finishing Society of Japan 01.01.2024
Japan Science and Technology Agency
Subjects
Ammonium nitrate
Aqueous solutions
Chemical Bath Deposition
Chemical reactions
Chemical Reduction
Copper
Copper Layer
Glass Substrate
Glass substrates
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Summary:A metallic Cu layer was fabricated on a glass substrate using chemical bath deposition of Cu（OH）2/Cu（O,S）bilayer in aqueous solutions containing copper（II）nitrate hydrate, ammonium nitrate, and thiourea or urea, followed by chemical reduction in a sodium borohydride solution. The Cu layer possessed resistance of 0.68 Ω/□ and maximum peeling strength of 13.4 N/cm.
ISSN:0915-1869
1884-3409
DOI:10.4139/sfj.75.40