Liquid Cooling System for Advanced Microelectronics

Heat removal from advanced microelectronic devices is becoming a major packaging challenge. Thermal management solutions such as microchannel liquid cooling are now becoming commercially available. The use of a liquid cooling system is attractive because of higher heat transfer coefficients or lower...

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Bibliographic Details
Published inECS transactions Vol. 6; no. 8; pp. 13 - 31
Main Authors Datta, Madhav, Lin, Eric, Choi, Hae-Won, McMaster, Mark, Brewer, Rick, Werner, Doug, Hom, James, Upadhya, Girish, Gopalakrishnan, Sudhakar, Rebarber, Fred
Format Journal Article
LanguageEnglish
Published 28.09.2007
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Summary:Heat removal from advanced microelectronic devices is becoming a major packaging challenge. Thermal management solutions such as microchannel liquid cooling are now becoming commercially available. The use of a liquid cooling system is attractive because of higher heat transfer coefficients or lower thermal resistance as compared to traditional heat pipe or heat sink solutions. In this paper we present a description of the key features of Cooligy's closed loop Liquid Cooling System (LCS). Two key components of the LCS, namely a microheat exchanger and an electrokinetic pump are discussed in detail. Published literature on advanced thermal interface materials and nanofluids are briefly reviewed. Wherever applicable, the importance and impact of electrochemical processing and materials aspects are highlighted.
ISSN:1938-5862
1938-6737
DOI:10.1149/1.2794452