Comparison and Analysis of Power Cycling and Thermal Cycling Lifetime of IGBT Module

In human transportation field, like electric vehicle and high-speed train, the insulated gate bipolar transistor (IGBT) module is more and more widely used. These applications where the personnel safety is seriously concerned usually require IGBT modules with higher reliability. In this paper the ty...

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Bibliographic Details
Published in2018 21st International Conference on Electrical Machines and Systems (ICEMS) pp. 876 - 880
Main Authors Zhang, Jin, Qiu, Zhijie, Zhang, Erxiong, Ning, Puqi
Format Conference Proceeding
LanguageEnglish
Published KIEE EMECS (KIEE Electrical Machinery and Energy Conversion Systems) 01.10.2018
Subjects
Automotive engineering
Degradation
Delamination
IGBT
Insulated gate bipolar transistors
power cycling
Reliability
Stress
thermal cycling
Wires
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Summary:In human transportation field, like electric vehicle and high-speed train, the insulated gate bipolar transistor (IGBT) module is more and more widely used. These applications where the personnel safety is seriously concerned usually require IGBT modules with higher reliability. In this paper the typical automotive and industrial grade IGBT products were selected, and both the power cycling and thermal cycling tests were carried out to compare the reliability difference. The experimental results showed that the thermal cycling lifetime of automotive IGBTs was obviously better than that of industrial grade products, however the power cycling lifetime of automotive IGBT was worse than that of the industrial grade products.
DOI:10.23919/ICEMS.2018.8549346