Electroless Deposition of Tin Using Contact with Zinc Powder in the Bath

Electroless deposition of tin film is an important process, particularly for joining in flexible printed circuit board (FPC) and chip-on-film (COF) tapes. Electroless deposition of tin from the tin (II)-citrate bath was investigated using contact with zinc powder in the bath. Tin was deposited elect...

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Published inHyōmen gijutsu Vol. 65; no. 9; pp. 453 - 457
Main Authors UCHIDA, Ei, TANAKA, Kaoru, KAWABATA, Ai, NABESHIMA, Shota, TSURUOKA, Takaaki, AKAMATSU, Kennsuke, NAWAFUNE, Hidemi
Format Journal Article
LanguageEnglish
Published Tokyo Japan Science and Technology Agency 01.09.2014
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Summary:Electroless deposition of tin film is an important process, particularly for joining in flexible printed circuit board (FPC) and chip-on-film (COF) tapes. Electroless deposition of tin from the tin (II)-citrate bath was investigated using contact with zinc powder in the bath. Tin was deposited electrolessly onto a copper substrate by contact with zinc powder in the tin (II)-citrate bath. The process, which is environmentally friendly, provides a high tin deposition rate of approximately 8 μmh-1. That rate is much higher than that of the autocatalytic deposition process using TiCl3 as a reducing agent. Furthermore, no copper substrate dissolution was observed. Results of local polarization curve measurements indicate that the mixed potential theory is applicable to this reaction.
ISSN:0915-1869
1884-3409
DOI:10.4139/sfj.65.453