DJOSER: Analytical Thermal Simulator for Multilayer Electronic Structures. Theory and Numerical Implementation

This paper presents a steady-state thermal simulation strategy called DJOSER, which is dedicated primarily but not exclusively to packaging structures for electronic devices. It is applicable to structures that can be likened to a set of homogeneous layers stacked one on top of the other and possibl...

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Bibliographic Details
Published in2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application pp. 77 - 84
Main Authors Bagnoli, P.E., Casarosa, C.E., Stefani, F.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.01.2007
Subjects
Analytical models
Assembly
Electronic packaging thermal management
Integral equations
Nonhomogeneous media
Power system modeling
Resistance heating
Steady-state
Temperature distribution
Thermal resistance
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Summary:This paper presents a steady-state thermal simulation strategy called DJOSER, which is dedicated primarily but not exclusively to packaging structures for electronic devices. It is applicable to structures that can be likened to a set of homogeneous layers stacked one on top of the other and possibly separated by thermal contact resistances, where the dissipated powers are due to two-dimensional heat sources distributed on the interfaces between the layers. A broad range of contour conditions and types of dissipated powers is included to make the models as close as possible to the typical structures of modern assembly technologies. Flow and temperature distributions are obtained via a system of integral equations that can be translated directly, with the usual squaring techniques, into a linear algebraic system
ISBN:1424408962
9781424408962
DOI:10.1109/THETA.2007.363413