Vibration failure processes evaluation of board level solder joints based on degeneration data

• Published in: 2017 Prognostics and System Health Management Conference (PHM-Harbin) pp. 1 - 5
• Main Authors: Yaojun Chen, Bo Jing, Zengjin Sheng, Fang Lu, Jiaxing Hu, Shuhao Si
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.07.2017
• Subjects: Degradation; Electronic equipment; failure; harmonic vibration; Monitoring; Prognostics and health management; prognostics and health management(PHM); Reliability; solder joints; Soldering; statistics; Vibrations
• ISSN: 2166-5656
• DOI: 10.1109/PHM.2017.8079303

Degeneration data can provide important life information of solder joints. In this paper, a statistical regression model is proposed to evaluate the failure process of board level solder joints under vibration load. First, the fixed frequency and amplitude vibration test is conducted, and the voltage signals at both sides of the solder joint are collected through a bleeder circuit and a high-speed multi-channel data acquisition system, followed by the extraction of the statistical characteristic of the failure signal, the establishment of a monotonic degeneration function, and the setup of thresholds for different failed processes. Finally, the real time voltage signal of the board-level solder joints is used to recognize and evaluate the different failure processes, so as to realize the early warning for electronic equipment. Through an experimental analysis, this method can effectively identify the status of solder joints, serving as a new approach to electronic equipment prognostics and health management (PHM) and providing a new detection method for the board-level electronics reliability assessment.