On-Site Application of End-Grain Bonded Timber Under Low Curing Temperatures

The end-grain bonding of timber components using the Timber Structures 3.0 technology (TS3) is an advancing construction method in timber engineering. This technology allows the realisation of any plate size by bonding plates on-site where low temperatures influence the performance. Therefore, inves...

Full description

Saved in:
Bibliographic Details
Published inJournal of sustainable architecture and civil engineering (Online) Vol. 34; no. 1; pp. 113 - 122
Main Authors Lins, Dio, Franke, Steffen
Format Journal Article
LanguageEnglish
Published Exeley Inc 19.02.2024
Subjects
Architecture
Energy and Environmental Studies
Methodology and research technology
endgrain bonded timber
CLT
flat slabs
onsite application
crosslaminated timber
temperature effect
Online AccessGet full text

Cover

More Information
Summary:The end-grain bonding of timber components using the Timber Structures 3.0 technology (TS3) is an advancing construction method in timber engineering. This technology allows the realisation of any plate size by bonding plates on-site where low temperatures influence the performance. Therefore, investigations are underway to evaluate the influence of the low temperatures on the curing process. Additionally, research is in progress to discover techniques to reduce any adverse effects of low curing temperatures on the mechanical properties of the bond. The implementation of particular measures, such as the inclusion of milled heating wires into the joint and the pre-heating of the joint with a hot air blower, has been identified as advancing the potential for grouting even in the face of low external temperatures, as recent research has indicated.
ISSN:2029-9990
2335-2000
DOI:10.5755/j01.sace.34.1.35788