Microstructure effects on thermal and electrical conductivities in the intermetallic compound Ag$$_{3}$$Sn-based materials, sintered by SPS in view of die-attachment applications

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Bibliographic Details
Published inThe European physical journal. ST, Special topics Vol. 231; no. 24; pp. 4173 - 4178
Main Authors Mahayri, R., Mercone, S., Giovannelli, F., Tan, K.-L., Morelle, J.-M., Jouini, N., Schoenstein, F.
Format Journal Article
LanguageEnglish
Published 01.12.2022
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ISSN:1951-6355
1951-6401
DOI:10.1140/epjs/s11734-022-00613-7