Meeting the plating challenges for the new electronic technologies
For the foreseeable future reel-to-reel plating systems are likely to remain the primary mechanisms for delivering high-quality, cost-effective plated components for electronically based products. Their role in product evolution and the speed of new product introduction are clear. Besides those ment...
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Published in | Metal finishing Vol. 99; no. 1; pp. 30 - 38 |
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Main Author | |
Format | Journal Article |
Language | English |
Published |
Elsevier Inc
2001
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Online Access | Get full text |
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Summary: | For the foreseeable future reel-to-reel plating systems are likely to remain the primary mechanisms for delivering high-quality, cost-effective plated components for electronically based products. Their role in product evolution and the speed of new product introduction are clear. Besides those mentioned here, there are a myriad of other tools, techniques, and methods in use and under development. What we have shown is ingenuity and creativity. This ingenuity and creativity will continue to allow us to meet the plating challenges of the new electronic technologies. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 0026-0576 1873-4057 |
DOI: | 10.1016/S0026-0576(01)80558-4 |