Rapid healing of internal cracks in C/C-SiC composite utilizing pure copper to improve the performance of C/C-SiC/Ti60 joints

• Published in: Journal of the European Ceramic Society Vol. 45; no. 2; p. 116884
• Main Authors: Zhao, Kehan, Li, Xingyi, Liu, Duo, Song, Yanyu, Song, Xiaoguo
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.02.2025
• Subjects: Ceramic-matrix composite; Crack healing; Fracture toughness; Grain boundary wetting; Joining; Joining; Ceramic-matrix composite; Crack healing; Grain boundary wetting; Fracture toughness
• ISSN: 0955-2219
• DOI: 10.1016/j.jeurceramsoc.2024.116884

This study developed a strategy for rapidly healing internal cracks in C/C-SiC composite. Remarkably, long cracks (∼500 μm) could be healed after treatment with pure copper in just 20 min. The impact of crack healing on the C/C-SiC/Ti60 joints was discussed. The rapid diffusion of Cu in SiC at high temperatures was revealed and proven to be driven by grain boundary wetting. Based on this, pure copper was utilized to heal the C/C-SiC composite. As the treatment temperatures were above 1500 °C, internal cracks could be effectively healed. The filling of Cu-rich phases and the stress field generated by the thermal mismatch between them and SiC facilitated the crack closure. Furthermore, the introduction of Cu-rich phases increased the composite's fracture toughness. As a result, the enhanced fracture toughness and crack healing improved the performance of C/C-SiC/Ti60 joints by 85 %. This work contributed to repairing ceramic-matrix composite and manufacturing lightweight brake systems.