All‐Transfer Electrode Interface Engineering Toward Harsh‐Environment‐Resistant MoS 2 Field‐Effect Transistors

Nanoscale electronic devices that can work in harsh environments are in high demand for wearable, automotive, and aerospace electronics. Clean and defect‐free interfaces are of vital importance for building nanoscale harsh‐environment‐resistant devices. However, current nanoscale devices are subject...

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Bibliographic Details
Published inAdvanced materials (Weinheim) Vol. 35; no. 18; p. e2210735
Main Authors Wu, Yonghuang, Xin, Zeqin, Zhang, Zhibin, Wang, Bolun, Peng, Ruixuan, Wang, Enze, Shi, Run, Liu, Yiqun, Guo, Jing, Liu, Kaihui, Liu, Kai
Format Journal Article
LanguageEnglish
Published Germany 01.05.2023
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Summary:Nanoscale electronic devices that can work in harsh environments are in high demand for wearable, automotive, and aerospace electronics. Clean and defect‐free interfaces are of vital importance for building nanoscale harsh‐environment‐resistant devices. However, current nanoscale devices are subject to failure in these environments, especially at defective electrode–channel interfaces. Here, harsh‐environment‐resistant MoS 2 transistors are developed by engineering electrode–channel interfaces with an all‐transfer of van der Waals electrodes. The delivered defect‐free, graphene‐buffered electrodes keep the electrode–channel interfaces intact and robust. As a result, the as‐fabricated MoS 2 devices have reduced Schottky barrier heights, leading to a very large on‐state current and high carrier mobility. More importantly, the defect‐free, hydrophobic graphene buffer layer prevents metal diffusion from the electrodes to MoS 2 and the intercalation of water molecules at the electrode–MoS 2 interfaces. This enables high resistances of MoS 2 devices with all‐transfer electrodes to various harsh environments, including humid, oxidizing, and high‐temperature environments, surpassing the devices with other kinds of electrodes. The work deepens the understanding of the roles of electrode–channel interfaces in nanoscale devices and provides a promising interface engineering strategy to build nanoscale harsh‐environment‐resistant devices.
ISSN:0935-9648
1521-4095
DOI:10.1002/adma.202210735