P‐82: Analysis and Validation of TFT‐LCD Data Open Mechanism

In this paper we reported a novel technology to improve Data Open. The relationship between process material and data open was analyzed between many materials. After a lot of experimental verification and analysis of the mechanism. A method to assess Data Open risk is developed with corresponding Cu...

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Bibliographic Details
Published inSID International Symposium Digest of technical papers Vol. 55; no. 1; pp. 1709 - 1712
Main Authors Xie, Zhongjing, Yang, Chunliu, Liang, Ping, Li, Ji
Format Journal Article
LanguageEnglish
Published Campbell Wiley Subscription Services, Inc 01.06.2024
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ISSN0097-966X
2168-0159
DOI10.1002/sdtp.17899

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Summary:In this paper we reported a novel technology to improve Data Open. The relationship between process material and data open was analyzed between many materials. After a lot of experimental verification and analysis of the mechanism. A method to assess Data Open risk is developed with corresponding Cu acid standards process change to ensure product reliability requirements are met.
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ISSN:0097-966X
2168-0159
DOI:10.1002/sdtp.17899