P‐82: Analysis and Validation of TFT‐LCD Data Open Mechanism
In this paper we reported a novel technology to improve Data Open. The relationship between process material and data open was analyzed between many materials. After a lot of experimental verification and analysis of the mechanism. A method to assess Data Open risk is developed with corresponding Cu...
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Published in | SID International Symposium Digest of technical papers Vol. 55; no. 1; pp. 1709 - 1712 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
Campbell
Wiley Subscription Services, Inc
01.06.2024
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Subjects | |
Online Access | Get full text |
ISSN | 0097-966X 2168-0159 |
DOI | 10.1002/sdtp.17899 |
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Summary: | In this paper we reported a novel technology to improve Data Open. The relationship between process material and data open was analyzed between many materials. After a lot of experimental verification and analysis of the mechanism. A method to assess Data Open risk is developed with corresponding Cu acid standards process change to ensure product reliability requirements are met. |
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Bibliography: | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 14 |
ISSN: | 0097-966X 2168-0159 |
DOI: | 10.1002/sdtp.17899 |