Permanent Bonding with Polymers

Many packaging applications for MEMS devices are using a variety of polymer materials. Polymer bonding has many advantages including a high tolerance to surface topography and particles, low cost, and shorter processing times. There are many varieties of polymers to choose from and engineered interf...

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Bibliographic Details
Published inECS transactions Vol. 16; no. 8; pp. 141 - 146
Main Authors Farrens, Shari, Sood, Sumant, Ishida, Hiroyuki
Format Journal Article
LanguageEnglish
Published 03.10.2008
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Summary:Many packaging applications for MEMS devices are using a variety of polymer materials. Polymer bonding has many advantages including a high tolerance to surface topography and particles, low cost, and shorter processing times. There are many varieties of polymers to choose from and engineered interfaces can be designed. The processing of the polymer must be reviewed from deposition to final testing to ensure that all functional requirements are met.
ISSN:1938-5862
1938-6737
DOI:10.1149/1.2982863