3D-Printed Optics for Wafer-Scale Probing

Mass production of photonic integrated circuits requires high-throughput wafer-level testing. We demonstrate that optical probes equipped with 3D-printed elements allow for efficient coupling of light to etched facets of nanophotonic waveguides. The technique is widely applicable to different integr...

Full description

Saved in:
Bibliographic Details
Main Authors Trappen, Mareike, Blaicher, Matthias, Dietrich, Philipp-Immanuel, Hoose, Tobias, Xu, Yilin, Billah, Muhammad Rodlin, Freude, Wolfgang, Koos, Christian
Format Journal Article
LanguageEnglish
Published 31.08.2018
Subjects
Online AccessGet full text

Cover

Loading…
Abstract Mass production of photonic integrated circuits requires high-throughput wafer-level testing. We demonstrate that optical probes equipped with 3D-printed elements allow for efficient coupling of light to etched facets of nanophotonic waveguides. The technique is widely applicable to different integration platforms.
AbstractList Mass production of photonic integrated circuits requires high-throughput wafer-level testing. We demonstrate that optical probes equipped with 3D-printed elements allow for efficient coupling of light to etched facets of nanophotonic waveguides. The technique is widely applicable to different integration platforms.
Author Dietrich, Philipp-Immanuel
Koos, Christian
Xu, Yilin
Billah, Muhammad Rodlin
Hoose, Tobias
Trappen, Mareike
Blaicher, Matthias
Freude, Wolfgang
Author_xml – sequence: 1
  givenname: Mareike
  surname: Trappen
  fullname: Trappen, Mareike
– sequence: 2
  givenname: Matthias
  surname: Blaicher
  fullname: Blaicher, Matthias
– sequence: 3
  givenname: Philipp-Immanuel
  surname: Dietrich
  fullname: Dietrich, Philipp-Immanuel
– sequence: 4
  givenname: Tobias
  surname: Hoose
  fullname: Hoose, Tobias
– sequence: 5
  givenname: Yilin
  surname: Xu
  fullname: Xu, Yilin
– sequence: 6
  givenname: Muhammad Rodlin
  surname: Billah
  fullname: Billah, Muhammad Rodlin
– sequence: 7
  givenname: Wolfgang
  surname: Freude
  fullname: Freude, Wolfgang
– sequence: 8
  givenname: Christian
  surname: Koos
  fullname: Koos, Christian
BackLink https://doi.org/10.48550/arXiv.1808.10834$$DView paper in arXiv
BookMark eNotzr1qAkEUQOEpkkJNHiCV21rM5t752ZktxcQoCAoRUi53x7kyYHZllKBvHzSpTnf4huKh67soxAtCaby18Er5kn5K9OBLBK_NQEz0m9zk1J3jrlgfzymcCu5z8UUcs_wMdIjFJvdt6vZP4pHpcIrP_x2J7fx9O1vI1fpjOZuuJFXOSEsIxhGh3iG4mmtgUD5WVQCLQfnAobWavUPkoBxbrjW1ZGJUaLQKeiTGf9u7tTnm9E352tzMzd2sfwHlhTvs
ContentType Journal Article
Copyright http://arxiv.org/licenses/nonexclusive-distrib/1.0
Copyright_xml – notice: http://arxiv.org/licenses/nonexclusive-distrib/1.0
DBID GOX
DOI 10.48550/arxiv.1808.10834
DatabaseName arXiv.org
DatabaseTitleList
Database_xml – sequence: 1
  dbid: GOX
  name: arXiv.org
  url: http://arxiv.org/find
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
ExternalDocumentID 1808_10834
GroupedDBID GOX
ID FETCH-LOGICAL-a674-5a1047aa13d1079f90f028e66c051c28cfcb53f8711fc27f5f93aba4ee21432c3
IEDL.DBID GOX
IngestDate Mon Jan 08 05:45:46 EST 2024
IsDoiOpenAccess true
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-a674-5a1047aa13d1079f90f028e66c051c28cfcb53f8711fc27f5f93aba4ee21432c3
OpenAccessLink https://arxiv.org/abs/1808.10834
ParticipantIDs arxiv_primary_1808_10834
PublicationCentury 2000
PublicationDate 2018-08-31
PublicationDateYYYYMMDD 2018-08-31
PublicationDate_xml – month: 08
  year: 2018
  text: 2018-08-31
  day: 31
PublicationDecade 2010
PublicationYear 2018
Score 1.7083704
SecondaryResourceType preprint
Snippet Mass production of photonic integrated circuits requires high-throughput wafer-level testing. We demonstrate that optical probes equipped with 3D-printed...
SourceID arxiv
SourceType Open Access Repository
SubjectTerms Physics - Applied Physics
Title 3D-Printed Optics for Wafer-Scale Probing
URI https://arxiv.org/abs/1808.10834
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwdV07T8MwED61nVgQCFB5ygMLg0XiR-qMCCgVErQSRWSL_DgjlqoKBfHzOSdBsLDaXu588vfd-fwZ4DzphaB3OU_Rw-nAQ26l8lyh1pEIAgVNqnc8PBazZ3Vf6WoA7OctjG2-3j47fWD3fpmbzKQuOKmGMBQitWzdzavucrKV4urX_64jjtkO_QGJ6Q5s9-yOXXXbsQsDXO3BhbzhiybpMgQ2XydZZEZMkb3YiA1_Ih8hWyQ1pNXrPiynt8vrGe9_KOC2mCiubRI6sDaXgbKoMpZZJLjGovAU6l4YH73TMlJOkkcvJlHHUlpnFaIgmiK8PIARJfk4BuatsHmBUTkbVMhkGQSlj8aZ4DOJE38I49auet2JUNTJ5Lo1-ej_qWPYIoA3XQ30BEab5gNPCUQ37qz15Df9Qm-N
link.rule.ids 228,230,783,888
linkProvider Cornell University
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=3D-Printed+Optics+for+Wafer-Scale+Probing&rft.au=Trappen%2C+Mareike&rft.au=Blaicher%2C+Matthias&rft.au=Dietrich%2C+Philipp-Immanuel&rft.au=Hoose%2C+Tobias&rft.date=2018-08-31&rft_id=info:doi/10.48550%2Farxiv.1808.10834&rft.externalDocID=1808_10834